Zapit

Description & Application

Zapit BASE was developed to fill-in all voids and undercuts, or to correct anomalies in models and dies.

Zapit is also used to join wax patterns, metal, or porcelain segments together prior to removal from the model. The Zapit system is excellent for:

1. As mentioned above, the Zapit System is the standard in the industry for ‘fixing’ any anomalies (air bubbles, undercuts, base-up areas, etc.), in working dies.

2. Relating cast parts together prior to fabricating a matrix for soldering procedures.

3. Partial and orthodontic laboratories can also use Zapit to maintain the position of clasps or wires on the model, again while producing a matrix for soldering procedures.

4. Zapit is also helpful in holding precision attachments and implant parts in position during complicated fabrication procedures.

5. Zapit ACCELERATOR is used extensively to set or harden traditional cyanoacrylate adhesives for use with model & die repairs; the gluing into position of dowel pins; or quickly adhering glue-on articulators to stone or plastic bases.

Competitive products used for similar applications:

WAXES: Undercut Wax, Sticky Wax, Block-out Wax
PLASTICS: Duralay, GC Pattern Resin
COMPOSITES: Light-Cured Composites

All of these products require more time to apply, are not as easily shaped, manipulated and molded. They are significantly more expensive to use.

Intra-oral Applications:

While Zapit was never designed or marketed for use in the mouth to index crowns or bridges, many dentists have taken it upon themselves to use the product for these purposes. DVA cannot recommend or suggest the use of Zapit for intra-oral applications to a customer as it has not been submitted to the FDA for use in the mouth. None-the-less, Zapit has appeared in many published technical articles recommending its use as an excellent product for joining bridge segments, crowns, or implants intra-orally prior to removal for soldering procedures.

Benefits & Features

Product Benefits:

Simplifies die repairs & preparation Improves accuracy of multiple-unit bridges. Indicates existence of undercut areas in preparations. Eliminates contamination of soldering surfaces Improves Economy

Product Features:

Use of Zapit System is simple, fast and easy-to-control. Zapit Base shrinks less than wax. Less shrinkage means less distortion. Zapit, while strong, is somewhat brittle and will ‘break apart’ if any portion of the wax pattern is ‘catching’ in the prep. Zapit burns-out cleaner than resins. Only the amount needed is consumed.